Diodes recognizes that semiconductor manufacturing is an energy-intensive process with the majority of our energy being consumed within our wafer fabrication and assembly and test facilities. We are committed to lowering climate risks related to our global carbon footprint by applying responsible energy management, driving energy efficiency, and pursuing reduction of energy use at the manufacturing sites and office buildings we occupy worldwide.

百利通亞陶認(rèn)識(shí)到半導(dǎo)體制造,研發(fā)精密的SMD晶振是一個(gè)能源密集型的過程我們的大部分能量消耗在晶圓制造、組裝和測(cè)試過程中設(shè)施。我們致力于通過以下方式降低與全球碳足跡相關(guān)的氣候風(fēng)險(xiǎn)應(yīng)用負(fù)責(zé)任的能源管理，推動(dòng)能源效率，并追求減少我們?cè)谑澜绺鞯氐纳a(chǎn)基地和辦公大樓的能源使用情況。風(fēng)靡一時(shí)的Diodes諧振器FL400WFQA1,為何能留下不可磨滅的記憶?ECERA無源晶振

有源晶體振蕩器環(huán)路在振蕩器頻率下具有低輸入阻抗，但在諧振頻率范圍之外具有高輸入阻抗特性。

當(dāng)在其附近施加電場(chǎng)時(shí)，這種高阻抗特性很容易受到EMI的影響。較新的技術(shù)已將振蕩器信號(hào)電平限制在 <1V，使其更容易受到影響。

為了強(qiáng)調(diào)保持低雜散 PCB 電容的重要性，突出顯示了計(jì)算中的 Cs。晶體的CL越低，PCB 雜散電容對(duì)設(shè)計(jì)的影響就越大。伊西斯推出的ECS-.327-12.5-34B-TR這是一款微型,最具成本效益的貼片晶體

XRCPB33M868F4M00R0村田晶振XRCGB25M000F2P02R0貼片石英晶振XRCHA20M000F0A01R0村田SMD晶振XRCPB40M000F0L00R0日產(chǎn)村田小體積晶振XRCGB25M000F3A00R0村田SMD晶振XRCHA20M000F0A11R0日產(chǎn)村田小體積晶振XRCPB40M000F0Z00R0進(jìn)口村田壓電石英晶體XRCGB25M000F3G00R0日產(chǎn)村田小體積晶振XRCHA20M000F0A12R0進(jìn)口村田壓電石英晶體XRCPB40M000F4M00R0村田石英貼片晶振XRCGB25M000F3M00R0進(jìn)口村田壓電石英晶體XRCHA20M000F0A13R0村田石英貼片晶振XRCPB48M000F0L00R0耐高溫貼片晶振XRCGB25M000F3M01R0村田石英貼片晶振XRCHA20M000F0L01R0耐高溫貼片晶振XRCPB48M000F0Z00R0車載晶振XRCGB25M000F3M02R0耐高溫晶振XRCHA20M000F0Z01R0車載晶振XRCPB48M000F4M00R0進(jìn)口murata晶振XRCGB25M000F3M04R0車載晶振XRCHA24M000F0A01R0進(jìn)口murata晶振XRCMD40M000FXQ57R0日產(chǎn)村田小體積晶振XRCGB25M000F3M18R0進(jìn)口murata晶振XRCHA24M000F0A11R0超小型SMD晶振XRCMD40M000FXQ58R0進(jìn)口村田壓電石英晶體XRCGB25M000F3N00R0超小型SMD晶振XRCHA24M000F0A12R0村田石英晶體諧振器XRCMD48M000FXQ58R0村田石英貼片晶振XRCGB25M000FAN00R0村田石英晶體諧振器XRCHA24M000F0A13R0貼片石英晶振XRCPB24M000F0L00R0耐高溫貼片晶振XRCGB25M000FAN12R0貼片石英晶振XRCHH16M000F1QB7P0村田SMD晶振XRCPB24M000F0Z00R0車載晶振XRCGB26M000F0G00R0村田SMD晶振XRCHH20M000F1QB1P0日產(chǎn)村田小體積晶振XRCPB24M000F2P00R0進(jìn)口murata晶振XRCGB26M000F0L00R0日產(chǎn)村田小體積晶振XRCHH26M000F1QD8P0進(jìn)口村田壓電石英晶體XRCPB24M000F3M00R0超小型SMD晶振XRCGB26M000F0Z00R0進(jìn)口村田壓電石英晶體XRCHH36M000F1QA3P0村田石英貼片晶振XRCPB24M000F3N00R0村田石英晶體諧振器XRCGB26M000F1H00R0村田石英貼片晶振XRCHH40M000F1QB3P0耐高溫貼片晶振XRCPB24M000FAN00R0貼片石英晶振XRCGB26M000F1H01R0耐高溫貼片晶振XRCHH52M000F1QA2P0車載晶振XRCPB24M576F0L00R0村田SMD晶振XRCGB26M000F1H02R0車載晶振XRCHJ16M000F1QB1P0進(jìn)口murata晶振XRCPB24M576F0Z00R0日產(chǎn)村田小體積晶振XRCGB26M000F1H03R0進(jìn)口murata晶振XRCHJ19M200F1QA9P0超小型SMD晶振XRCPB24M576F3M00R0進(jìn)口晶振XRCGB26M000F2P00R0超小型SMD晶振XRCHJ20M000F1QA7P0村田石英晶體諧振器XRCPB24M576F3N00R0村田石英貼片晶振XRCGB26M000F2P01R0村田石英晶體諧振器XRCHJ26M000F1QD1P0貼片石英晶振XRCPB24M576FAN00R0耐高溫貼片晶振XRCGB26M000F2P02R0貼片石英晶振XRCHJ36M000F1QA0P0村田SMD晶振XRCPB25M000F0L00R0車載晶振XRCGB26M000F3A00R0村田SMD晶振XRCHJ40M000F1QB0P0日產(chǎn)村田小體積晶振XRCPB25M000F0Z00R0進(jìn)口murata晶振XRCGB26M000F3G00R0日產(chǎn)村田小體積晶振XRCHJ52M000F1QA0P0進(jìn)口村田壓電石英晶體XRCPB25M000F2P00R0超小型SMD晶振XRCGB26M000F3M00R0進(jìn)口村田壓電石英晶體XRCJH13M000F1QA0P0村田石英貼片晶振XRCPB25M000F3M00R0村田石英晶體諧振器XRCGB26M000F3M01R0村田石英貼片晶振XRCJH16M000F1QB5P0耐高溫石英晶振XRCPB25M000F3N00R0貼片石英晶振XRCGB26M000F3M02R0耐高溫貼片晶振XRCJH20M000F1QB3P0車載晶振XRCPB25M000FAN00R0村田SMD晶振XRCGB26M000F3N00R0車載晶振XRCJH26M000F1QC1P0進(jìn)口murata晶振XRCGB31M250F0L00R0村田SMD晶振XRCGB26M000FAN00R0進(jìn)口murata晶振XRCJH36M000F1QA1P0超小型SMD晶振XRCGB31M250F0Z00R0日產(chǎn)村田小體積晶振XRCGB27M000F0G00R0超小型SMD晶振XRCJH40M000F1QB2P0村田石英晶體諧振器XRCGB31M250F2P00R0進(jìn)口村田壓電石英晶體XRCGB27M000F0L00R0村田石英晶體諧振器XRCJH52M000F1QA1P0貼片石英晶振XRCGB31M250F2P01R0村田石英貼片晶振XRCGB27M000F0Z00R0貼片石英晶振XRCJK12M000F1QB4P0村田SMD晶振XRCGB31M250F2P02R0耐高溫貼片晶振XRCGB27M000F2P00R0村田SMD晶振XRCJK13M000F1QA3P0日產(chǎn)村田小體積晶振XRCGB31M250F3M00R0車載晶振XRCGB27M000F2P01R0日產(chǎn)村田小體積晶振XRCJK15M360F1QA0P0進(jìn)口村田壓電石英晶體XRCGB31M250F3M01R0進(jìn)口murata晶振XRCGB27M000F2P02R0進(jìn)口村田壓電石英晶體XRCJK20M000F1QB3P0村田石英貼片晶振XRCGB31M250F3M02R0超小型SMD晶振XRCGB27M000F3A00R0村田石英貼片晶振XRCJK24M576F1QA0P0耐高溫貼片晶振XRCGB31M250F3N00R0村田石英晶體諧振器XRCGB27M000F3G00R0耐高溫貼片晶振XRCJK26M000F1QC3P0車載晶振XRCGB31M250FAN00R0貼片石英晶振XRCGB27M000F3M00R0車載晶振XRCJK36M000F1QA0P0進(jìn)口murata晶振XRCGB32M000F0L00R0村田SMD晶振XRCGB27M000F3M01R0進(jìn)口murata晶振XRCJK40M000F1QA2P0超小型SMD晶振XRCGB32M000F0Z00R0日產(chǎn)村田小體積晶振XRCGB27M000F3M02R0超小型SMD晶振XRCJK52M000F1QA0P0村田石英晶體諧振器XRCGB32M000F1H00R0進(jìn)口村田壓電石英晶體XRCGB27M000F3M14R0村田石英晶體諧振器XRCLH10M000F1QA4J1貼片石英晶振XRCGB32M000F1H01R0村田石英貼片晶振XRCGB27M000F3N00R0貼片石英晶振XRCLH10M000F1QA4P0村田SMD晶振XRCGB32M000F1H02R0耐高溫貼片晶振XRCGB27M000FAN00R0村田SMD晶振XRCLH12M000F1QA0J1日產(chǎn)村田石英貼片晶振XRCGB32M000F1H03R0車載晶振XRCGB27M000FAN16R0日產(chǎn)村田小體積晶振XRCLH12M000F1QA0P0進(jìn)口村田壓電石英晶體XRCGB32M000F2P00R0進(jìn)口murata晶振XRCGB27M120F0L00R0進(jìn)口村田壓電石英晶體XRCLH14M745F1QA0J1村田石英貼片晶振XRCGB32M000F2P01R0超小型SMD晶振XRCGB27M120F0Z00R0村田石英貼片晶振XRCLH14M745F1QA0P0耐高溫貼片晶振XRCGB32M000F2P02R0村田石英晶體諧振器XRCGB27M120F2P00R0耐高溫貼片晶振XRCLH16M000F1QA2J1車載晶振XRCGB32M000F2P10R0貼片石英晶振XRCGB27M120F2P01R0車載晶振XRCLH16M000F1QA2P0進(jìn)口murata晶振XRCLK52M000F1QA0P0進(jìn)口村田壓電石英晶體XRCGB27M120F2P02R0進(jìn)口murata晶振XRCLH21M250F1QA0J1超小型SMD晶振XRCMD32M000F1P00R0村田石英貼片晶振XRCGB27M120F2P10R0超小型SMD晶振XRCLH21M250F1QA0P0村田石英晶體諧振器XRCMD32M000FXP50R0耐高溫貼片晶振XRCGB27M120F3A00R0村田石英晶體諧振器XRCLH52M000F1QA1J1貼片石英晶振XRCMD32M000FXP52R0車載晶振XRCGB27M120F3G00R0貼片石英晶振XRCLH52M000F1QA1P0村田SMD晶振XRCMD32M000FXP53R0進(jìn)口murata晶振XRCGB27M120F3M00R0村田SMD晶振XRCLK10M000F1QA8J1日產(chǎn)村田小體積晶振XRCMD32M000FXP54R0超小型SMD晶振XRCGB27M120F3M01R0日產(chǎn)村田超小型無源貼片晶振XRCLK10M000F1QA8P0進(jìn)口村田壓電石英晶體XRCMD32M000FZQ52R0村田石英晶體諧振器XRCGB27M120F3M02R0進(jìn)口村田壓電石英晶體XRCLK12M000F1QA6J1村田石英貼片晶振XRCMD37M400F1Q01R0貼片石英晶振XRCGB27M120F3M10R0村田石英貼片晶振XRCLK12M000F1QA6P0耐高溫貼片晶振XRCMD38M400FXQ56R0村田SMD晶振XRCGB27M120F3M13R0耐高溫貼片晶振XRCLK14M745F1QB6J1車載晶振XRCGB30M000F2P00R0日產(chǎn)村田小體積晶振XRCGB27M120F3N00R0車載晶振XRCLK14M745F1QB6P0進(jìn)口murata晶振XRCGB30M000F2P01R0進(jìn)口村田壓電石英晶體XRCGB27M120F3P00R0進(jìn)口murata晶振XRCLK16M000F1QA7J1超小型SMD晶振XRCGB30M000F2P02R0村田石英貼片晶振XRCGB27M120FAN00R0超小型SMD晶振XRCLK16M000F1QA7P0村田石英晶體諧振器XRCGB30M000F3G00R0耐高溫貼片晶振XRCGB30M000F0G00R0村田石英晶體諧振器XRCLK21M250F1QA8J1貼片石英晶振XRCGB30M000F3M00R0車載晶振XRCGB30M000F0L00R0貼片石英晶振XRCLK21M250F1QA8P0村田SMD晶振XRCGB30M000F3M01R0進(jìn)口murata晶振XRCGB30M000F0Z00R0村田SMD晶振XRCLK52M000F1QA0J1日產(chǎn)村田小體積晶振XRCGB30M000F3M02R0超小型SMD晶振XRCGB30M000FAN00R0貼片石英晶振XRCGB30M000F3N00R0村田SMD石英晶體

所以盡管目前智能手機(jī)市場(chǎng)以及低端穿戴電子產(chǎn)品市場(chǎng)都處于低迷狀態(tài)，當(dāng)物聯(lián)網(wǎng)的推動(dòng)一定可以為貼片晶振產(chǎn)業(yè)注入新鮮血液，為石英晶體諧振器及石英晶體振蕩器未來發(fā)展提供新的契機(jī)與方向。而我們晶振生產(chǎn)廠家要做的則是一方面保證現(xiàn)有市場(chǎng)的需求供給，另一方面對(duì)于更多的需求領(lǐng)域不單要不斷挖掘，更好做到積極創(chuàng)新滿足市場(chǎng)需要。

現(xiàn)在國內(nèi)也有諸多實(shí)力雄厚,設(shè)備先進(jìn)的晶振廠家.冠杰電子就是國內(nèi)專業(yè)做晶振的模范廠家,主要集研發(fā),生產(chǎn),銷售為一體的晶振模范廠家.公司擁有萬級(jí)無塵車間.引進(jìn)國外最先進(jìn)的系統(tǒng)設(shè)備,和先進(jìn)的管理系統(tǒng).公司所生產(chǎn)的每一個(gè)晶振都是經(jīng)過多道工序,多名專業(yè)人員檢查合格方交予客戶.并且每一批產(chǎn)品生產(chǎn)完工在入庫之前都需要公司品質(zhì)部經(jīng)理檢查簽字方可入庫.公司主要生產(chǎn)32.768K常用晶振.同時(shí)代理日本,臺(tái)灣,美國的各大品牌,公司以優(yōu)秀的銷售業(yè)績獲得各大品牌的一級(jí)代理商許可證.公司產(chǎn)品有:石英晶振,陶瓷晶振,貼片晶振,插件晶振,有源晶振,霧化片,濾波器.公司努力去實(shí)現(xiàn)我們的宗旨:“與客戶共同成長,共創(chuàng)美好每天”為我國的科技發(fā)展獻(xiàn)出一份微薄之力.